Designing Low-Power Bluetooth LE Products

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Design
Lesson 1 – Power consumption essentials
4 Topics | 1 Quiz
A typical Bluetooth LE product architecture
Bluetooth LE communication methods
Electrical quantities
Exercise 1 – Estimating power budget
Lesson 1 quiz
Lesson 2 – Designing with a Nordic PMIC
7 Topics | 1 Quiz
PMIC overview
System management features with Nordic PMICs
System efficiency considerations
PMIC hardware integration
PMIC software integration
Getting started with Nordic PMICs
Exercise 1 – Powering nRF54L devices from a single AA/AAA battery
Lesson 2 quiz
Measure
Lesson 3 – Tools and best practices for power measurement
5 Topics | 1 Quiz
Current measurement fundamentals
Current measurement equipment: Capabilities, limitations, and best practices
Measurement setup validation and error mitigation
Exercise 1 – Setup verification using System OFF
Exercise 2 – Bluetooth LE advertising power profiling and data extrapolation
Lesson 3 quiz
Optimize
Lesson 4 – Bluetooth LE power optimization
4 Topics | 1 Quiz
Bluetooth LE advertising parameters and power consumption
Bluetooth LE connection parameters and power consumption
Exercise 1 – Optimizing power consumption during Bluetooth LE advertising
Exercise 2 – Optimizing power consumption in a Bluetooth LE connection
Lesson 4 quiz
Lesson 5 – SoC specific power optimization I
6 Topics | 1 Quiz
Clock sources
Peripherals
Memory retention and sleep modes
Exercise 1 – Estimating and measuring how clock sources affect power consumption
Exercise 2 – Comparing current consumption of peripherals from different power domains
Exercise 3 – Measuring the impact of RAM retention settings
Lesson 5 quiz
Lesson 6 – SoC specific power optimization II
6 Topics | 1 Quiz
GPIO interrupt types on the nRF54L Series
DPPI Distributed programmable peripheral interconnect
Direct Memory Access (EasyDMA)
Exercise 1 – Measuring sleep current with different GPIO interrupt types
Exercise 2 – Reducing CPU activity by connecting peripherals with DPPI
Exercise 3 – Reducing current consumption with EasyDMA
Lesson 6 quiz
Monitor
Lesson 7 – Remote monitoring of Bluetooth LE devices with nRF Cloud
8 Topics | 1 Quiz
Why remote observability matters for low-power Bluetooth LE devices
Key data points for Bluetooth LE connection stability and power efficiency
Integrating the Memfault SDK into a Bluetooth LE peripheral application
Fleet-wide analysis and debugging with nRF Cloud
Exercise 1 – Setting up the Memfault SDK on an nRF54L Series DK
Exercise 2 – Exploring the automatically collected Bluetooth LE metrics
Exercise 3 – Observing the impact of connection parameter changes on metrics
Exercise 4 – Invoking a firmware update over Bluetooth LE (OTA)
Lesson 7 quiz
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Clock sources

Low-frequency clock

For all Bluetooth Low Energy devices, the sleep phase is a crucial factor to consider during the design phase. It is even more important for battery-operated devices, as it has a direct influence on the device’s lifetime for each battery charge. When a low-current sleep phase is combined with longer connection/advertising intervals, some of the devices can run for many months on a single coin battery.

As opposed to the data exchange phase, the sleep phase is driven by a low-frequency clock.

The source of this clock can vary depending on the application. In the nRF54L Series, the low-frequency clock controller produces a 32.768 kHz clock signal that can be driven by the following sources (ordered by current consumption – least to most):

  • Crystal oscillator (LFXO)
  • RC oscillator (LFRC)
  • Synthesized from HFCLK (LFSYNT)

Accuracy

The accuracy of the low-frequency clock is represented by parts per million (ppm) and refers to how closely a clock’s output matches the ideal or intended frequency over time.

For device compatibility reasons, the Bluetooth Low Energy Standard specifies the low-frequency clock requirements, the Sleep Clock Accuracy (SCA), as follows:

  • Peripheral (Slave) ≤ 500 ppm
  • Central (Master) ≤ 50 ppm

Accuracy varies a lot depending on the source used to drive the low-frequency clock. The simplest option is to use an internal RC circuit integrated in the SoC. Despite its benefits, such as a short startup time (1 ms) and a smaller footprint, which reduce the device’s BOM cost, it comes with the cost of choosing this solution.

See the nRF54L Series datasheet 32.768 kHz clock source (LFCLK).

The LFRC frequency tolerance is at the 250 ppm level, and, moreover, it requires a calibration procedure to achieve this level of accuracy. Taking the SCA requirements into account, the accuracy does not meet the requirements for central devices, so this source is not an option for those cases.

To achieve better accuracy, you need to choose a different low-frequency clock source. The best option is using a crystal oscillator (LFXO). It requires an external crystal (with load capacitors, which are available on the SoC itself, to reduce the footprint).

See the crystal mounted on the nRF54L15 DK.

The BOM list includes the low-frequency crystal (20 ppm) document:

9HT11-32.768KDZC-T

The crystal data sheet specifies different values for frequency tolerance and load capacitance. When purchasing the crystal, you can specify which values the crystal should have. As specified in the BOM above, a 32 kHz crystal with +/-20 ppm and 9 pF for the nRF54L15 DK is used.

In addition, it can reduce the overall current consumption thanks to a lower run current (at least -0.6 µA @ 3V) and the absence of a calibration procedure.

The last possible option is to drive the low-frequency clock with a synthesized signal from a high-frequency clock. Although it can provide accuracy on LFXO level with no need for external components, the option is not recommended when battery life plays a role due to its huge current consumption.

Calibration procedure

A high-frequency clock can be used in the low-frequency clock controller not only for synthesizing the low-frequency clock. It also works as a solid reference for the calibration procedure. The internal RC circuit has a drift, causing inaccuracy in time measurement, so calibration is necessary. The nRF54L Series data sheet provides the procedure for calibration using a high-frequency crystal oscillator. Typically, calibration is performed every 4-8 s and enables a low-frequency clock with 250 ppm accuracy. The calibration procedure consumes a significant amount of energy and should be included in the power budget calculation.

Window widening

When the connection is established, the central and peripheral devices exchange data periodically according to the configured connection interval. Both use a low-frequency clock as a time source, which comes with a defined accuracy tolerance. This depends on the clock’s configuration and source. This inaccuracy can cause them to wake at slightly different times and miss transmissions. To prevent this, the Bluetooth Low Energy standard defines a mechanism called window widening (WW). Window widening allows the peripheral to increase the time it spends listening for packets from the central. The peripheral starts to listen before the expected transmission time (earlier by WW time ). It keeps listening to additional WW after that time (unless the transmission happens earlier). This time depends on the Sleep Clock Accuracy (SCA) of both devices. The peripheral knows its own SCA and receives the central’s SCA in the connection request. You can calculate the total window widening time using the following formula:

WindowWidening = (timeSinceLastAnchorPoint) × (SCA_central + SCA_peripheral) / 1,000,000 + 2* 16 µs

The timeSinceLastAnchorPoint is the last known point in time when both devices were communicating and is typically equal to the connection interval. During this time, the radio is enabled and configured to receive. The SoC current consumption in this mode needs to be included in the power budget calculation. The accuracy of the low-frequency clock significantly influences total power consumption. You can use the Online Power Profiler to see how different the window widening time will look when using an external crystal or an internal RC oscillator.

Current consumption

The previous sections covered the accuracy difference in low-frequency clock sources and the necessary actions when using an internal oscillator. Both the window-widening and calibration procedures increase the current consumption. Additionally, the run current of the oscillators varies. A device using the internal oscillator consumes approximately 0.6 μA more current than one with an external crystal during operation; this must be added to the total current consumption.

You can use the Online Power Profiler to see how selecting different low-frequency clock sources affects the device current consumption, including all the mentioned factors:

  • Calibration procedure
  • Window widening
  • Run current

Change the LF clock option in the Chip settings pane.

Footprint

Selecting a low-frequency clock significantly impacts the device’s footprint. When the accuracy and current consumption are the key factors, the crystal oscillator is the preferred source.

It requires an external crystal for the operation, which leads to increased footprint and cost of the device. The external crystal needs capacitors for operation.

The nRF54L Series devices not only support external capacitors for the crystal but also feature programmable internal capacitors ranging from 3 pF to 18 pF in 0.65 pF steps. This helps minimize the footprint of the device when selecting an external crystal as a low-frequency clock source.

When an external crystal is not an option, the internal RC circuit (LFRC) can still be used without any additional components. Worse clock accuracy and increased current consumption are expected in this configuration.

Summary

External oscillator (LFXO)Internal RC (LFRC)
AccuracyHighLow
Startup timeVery long (0.43 s)Short (1 ms)
Current consumptionLowMedium/high
Calibration neededNoEvery 4 s
Windows Widening (longer peripheral RX time)ShortLong
FootprintHigh/medium (capacitors in the SoC)Small (no external components needed)

High-frequency clock

The SoC needs a high-frequency clock for operation. It is distributed to the CPU, peripherals, and other system components. As with the low-frequency clock, there are more than one possible source for it. The high-frequency clock can run from:

  • Phase-locked loop (PLL) with internal oscillator (HFINT)
  • External crystal oscillator (HFXO)

Both solutions have strengths and weaknesses that affect the performance and current consumption. The nRF54L Series features dynamic control of these sources to deliver better performance when needed and reduce current consumption during idle or non-critical tasks.

In addition, when the device is powered up, it starts with an internal oscillator due to its short startup time of approximately 6 μs. For the external crystal oscillator, it also depends on the crystal size, affecting the footprint. It takes 200-300 μs to start the oscillator and 415-700 μs for a high-frequency clock to be calibrated, which is sufficient for many cases. The HFXO calibration is necessary for the radio operation and calibrating the low-frequency oscillator.

The external crystal has higher accuracy than other crystals. The following peripherals need the HFXO for operation and request the clock automatically when needed:

  • Radio
  • NFCT
  • UARTE

There is an additional group of components that can run using the internal clock HFINT, but enabling the external crystal improves their accuracy:

  • SAADC (reducing clock jitter)
  • Serial interfaces (accuracy and bitrate):
    • SPIM
    • SPIS
    • TWIM
    • TWIS

Using the external crystal comes with the additional factors that affect the footprint and power budget. Looking at the oscillator electrical specifications, you can notice that using a smaller crystal comes with increased current consumption and longer startup time. To help reduce the footprint, the nRF54L Series devices are equipped with internal configurable crystal capacitors. The external crystal oscillator, due to its higher accuracy, has a higher startup time and consumes much more current than an internal oscillator.

Internal oscillator (HFINT)External oscillator (HFXO) – crystal 2.0×1.6 mm crystalExternal oscillator (HFXO) – crystal 1.2×1.0 mm
FootprintSmallModerate/High (internal capacitors)Moderate (internal capacitors)
Startup timeShort (6 μs)Moderate (200 μs)Long (400 μs)
Startup & calibration time–Moderate (300 μs)Long (700 μs)
Current consumptionModerateHighHigh
AccuracyLowHighHigh

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      Change summary

      What's new in the latest version

      General updates

      General updates

      •Support for nRF54LS05 DK (Available through the early access sampling program)
      •Support for the nRF54LM20B with Axon NPU for Edge AI applications
      Bluetooth LE updates

      Bluetooth LE updates

      •Quality of Service module is now production-ready.
      •New experimental features for RF testing (Direct Test Mode) and low-latency packet handling (LE Flushable ACL).
      MCUboot & Partition Manager

      MCUboot & Partition Manager

      •Single-Slot DFU and RAM Load mode are both promoted to fully supported
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